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From Technology - Electronics

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Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Audi Selects Microchips MOST150 Technology for New Audi Q7 SUVs - Virtual Cockpit Infotainment System

Tue, 11 Aug 2015 11:17:14 EDT

[NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that AUDI AG is networking the Audi virtual cockpit system in its new high-class Q7 SUV Models using MOST® technology, following a similar deployment in its TT Coupe Models. Specifically, Audi is utilizing Microchip's OS81110 and OS81118 MOST150 Intelligent Network Interface Controllers (INICs) , which provide 150 Mbps performance and suppo...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199446


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


Toshiba Develops Worlds First 16-die Stacked NAND Flash Memory with TSV Technology

Thu, 6 Aug 2015 10:18:23 EDT

Toshiba Corporation (TOKYO:6502) today announced the development of the world's first*1 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA. - - - The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for th...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199324


IBM Research Alliance Produces Industrys First 7nm Node Test Chips

Thu, 9 Jul 2015 11:39:13 EDT

An alliance led by IBM Research (NYSE:IBM) today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors.  The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything ...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198776


A jump for soft¯bodied robots

Fri, 10 Jul 2015 11:48:54 EDT

Traditional robots are made of components and rigid materials like you might see on an automotive assembly line – metal and hydraulic parts, harshly rigid, and extremely strong. But away from the assembly line, for robots to harmoniously assist humans in close–range tasks scientists are designing new classes of soft–bodied robots. Yet one of the challenges is integrating soft materials with requisite rigid components that power and control the robot's body. At the interface of these materia...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198794


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


IBM Research Alliance Produces Industrys First 7nm Node Test Chips

Thu, 9 Jul 2015 11:39:13 EDT

An alliance led by IBM Research (NYSE:IBM) today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors.  The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything ...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198776


A jump for soft¯bodied robots

Fri, 10 Jul 2015 11:48:54 EDT

Traditional robots are made of components and rigid materials like you might see on an automotive assembly line – metal and hydraulic parts, harshly rigid, and extremely strong. But away from the assembly line, for robots to harmoniously assist humans in close–range tasks scientists are designing new classes of soft–bodied robots. Yet one of the challenges is integrating soft materials with requisite rigid components that power and control the robot's body. At the interface of these materia...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198794


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


IBM Research Alliance Produces Industrys First 7nm Node Test Chips

Thu, 9 Jul 2015 11:39:13 EDT

An alliance led by IBM Research (NYSE:IBM) today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors.  The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything ...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198776


A jump for soft¯bodied robots

Fri, 10 Jul 2015 11:48:54 EDT

Traditional robots are made of components and rigid materials like you might see on an automotive assembly line – metal and hydraulic parts, harshly rigid, and extremely strong. But away from the assembly line, for robots to harmoniously assist humans in close–range tasks scientists are designing new classes of soft–bodied robots. Yet one of the challenges is integrating soft materials with requisite rigid components that power and control the robot's body. At the interface of these materia...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198794


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


IBM Research Alliance Produces Industrys First 7nm Node Test Chips

Thu, 9 Jul 2015 11:39:13 EDT

An alliance led by IBM Research (NYSE:IBM) today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors.  The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything ...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198776


A jump for soft¯bodied robots

Fri, 10 Jul 2015 11:48:54 EDT

Traditional robots are made of components and rigid materials like you might see on an automotive assembly line – metal and hydraulic parts, harshly rigid, and extremely strong. But away from the assembly line, for robots to harmoniously assist humans in close–range tasks scientists are designing new classes of soft–bodied robots. Yet one of the challenges is integrating soft materials with requisite rigid components that power and control the robot's body. At the interface of these materia...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198794


Toshiba Expands Line-up of ARM Cortex® -M-based Microcontrollers

Mon, 27 Jul 2015 11:00:46 EDT

Toshiba Corporation (TOKYO: 6502) today announced that it has enhanced its current “TX Family” of ARM core-based microcontrollers and started to develop three series of microcontrollers, “TXZ0 series”, “TXZ3 series”, and “TXZ4 series”, as part of the “TXZ™ Family, ” a new family of flash microcontrollers that support low-power consumption and high-speed operation for IoT and M2M ecosystems. Sample shipments of “TXZ3 series” will start in the second quarter of 2016. - - - Toshiba has also sta...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=199117


IBM Research Alliance Produces Industrys First 7nm Node Test Chips

Thu, 9 Jul 2015 11:39:13 EDT

An alliance led by IBM Research (NYSE:IBM) today announced that it has produced the semiconductor industry's first 7nm (nanometer) node test chips with functioning transistors.  The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute's Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches -- transistors -- on the fingernail-sized chips that power everything ...

Read the full story at http://www.webwire.com/ViewPressRel.asp?aId=198776


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